Analyst Ming-Chi Kuo has echoed different reviews that Apple is predicted to make use of a brand new chip packaging know-how within the A20 chip, which can debut within the iPhone 18 subsequent yr. His report focuses on suppliers for chip packaging supplies, fairly than the advantages of the brand new course of. We heard the identical from analyst Jeff Pu a pair months in the past.
Whenever you purchase an iPhone 16 at the moment, the A19 chip inside is a reasonably large and complicated monolithic “system on a chip.” It’s received the CPU, GPU, Neural Engine, video and audio encoders and decoders, and a bunch of different little stuff all on one large complicated piece of silicon with round 30 billion transistors. Many chips are made on a giant silicon disk (referred to as a wafer) after which packaged up and minimize into particular person A19 chips, referred to as “dies.”
However the RAM just isn’t on the identical piece of silicon. RAM is usually manufactured utilizing completely different silicon processes, on completely different large wafers, minimize into their very own dies. Then the RAM is mixed with the large SoC by connecting the 2 collectively utilizing one other piece of silicon, referred to as an interposer.
That is completed as a result of the manufacturing processes that produces SRAM effectively is completely different than what produces logic effectively. However with a brand new TSMC know-how referred to as “Wafer-Stage Multi-Chip Module (WMCM) packaging,” that may all change.
This course of will make it attainable for Apple to construct a giant monolithic chip that consists of the RAM on the identical die because the CPU, GPU, Neural Engine, media encoders, and so forth. If the present rumors are right, this is able to be 12GB of RAM, however the course of doesn’t require any certain amount. Rumors level to the iPhone 18 as the primary machine to make use of the brand new chip, and the iPhone Fold may be a candidate.
On-die RAM could simplify the manufacturing course of, requiring fewer steps than the present RAM-on-interposer setup. However the profit for customers is the potential to have very broad and quick RAM interfaces, making entry to RAM virtually as quick as a high-level SRAM cache. This might drastically enhance efficiency in conditions which are restricted by reminiscence bandwidth, corresponding to high-performance 3D graphics or sure AI functions.
It might additionally enable for higher energy administration, permitting the SoC with built-in RAM to make use of much less energy than the present setup with RAM hooked up on an interposer. This will enhance battery life, however battery life is an element of many various elements just like the show, wi-fi radios, storage, and extra.